Cambridge GaN Devices (CGD) is a tech start-up with the mission to transform the way the world deploys energy by delivering the most efficient power switch. No more wasted energy and yes to efficient power electronics that can enable less CO2 emissions and smaller, less bulky electronics. CGD is a fabless semiconductor company, spun out of the world-renowned Electronics Department at the University of Cambridge, and is focused on designing, developing and commercialising power transistors and Integrated Circuits based on the most efficient material available, Gallium Nitride (GaN).
Triggered by a world-wide need to save energy and achieve a more sustainable use of natural resources, the power electronics market will see significant innovation over the next 10 years. Having already built a team who are leaders in their field, with decades of expertise in the power semiconductor industry, CGD are leading the way towards this energy-revolution.
Would you like to contribute to shaping the future of power electronics, by joining a growing team in a passionate and innovative environment? Join CGD and be part of the adventure!
CGD is now looking for a Packaging or Senior Packaging Engineer to join our growing engineering team. Reporting directly to the Director of Engineering, this is an amazing opportunity to join CGD at an early stage and help drive the packaging solutions for CGD’s GaN power products.
The Engineer will be responsible for leading the technical development of high performance and high-density semiconductor packaging solutions for CGD internal product development and public funded projects. This role will work closely with the GaN chip design team in R&D Engineering (design process), with the Operations team (packaging supply chain and support product qualification tests), and the Application Engineering team (to satisfy customers’ package requirements).
Reporting directly to the Director of Engineering, the Engineer will be responsible for:
Skills and Experience
Suitable candidates for the Packaging or Senior Packaging Engineers role will most likely have a background in designing and developing packages for semiconductor applications. Any experience in power related products and/or designing for GaN products would be advantageous, but not a requirement.
This role might also suit a strong mechanical or electromechanical engineer, who has experience with 3D drawing, understanding the thermal aspects of design, and/or electromagnetic considerations.
We believe in equal opportunities
It takes a diverse and inclusive community of passionate, talented and committed people to build a system to shape the future of power electronics. We’re an equal opportunity employer, and welcome applications from people of all backgrounds, with different outlooks and experiences.
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